Flip-chip bonding structure and method for making the same

Details Flip-chip bonding structure and method for making the same Flip-chip bonding structure and method for making the same

2005-01-11

2005-01-11

Kang, Donghee (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S688000, C257S778000, C257S797000, C257S090000, C257S094000, C257S096000, C257S097000

Reexamination Certificate

active

06841860

ABSTRACT:
Disclosed are a flip-chip bonding structure for improving the vertical alignment of an optical device relative to a PLC and a flip-chip bonding method for achieving this structure. The flip-chip bonding structure includes: a semiconductor substrate; a lower-clad layer formed on the upper surface of the semiconductor substrate, wherein the lower-clad layer is depressed on a designated area for mounting an optical device; vertical alignment structures formed on a part of the upper surface of the depressed area of the lower-clad layer and determining a vertical alignment position of the optical device on the semiconductor substrate; electrodes formed on another part of the upper surface of the depressed area of the lower-clad layer; a solder bump formed on the upper surfaces of the electrodes; and, an optical device bonded to the substrate by a flip-chip bonding method using the solder bump.

REFERENCES:
patent: 4148559 (1979-04-01), Gauthier
patent: 5369529 (1994-11-01), Kuo et al.
patent: 5923057 (1999-07-01), Son
patent: 6054716 (2000-04-01), Sonobe et al.
patent: 6127716 (2000-10-01), Morizuka et al.
patent: 6143991 (2000-11-01), Moriyama
patent: 6172382 (2001-01-01), Nagahama et al.
patent: 6323059 (2001-11-01), Yoshida et al.
patent: 6459146 (2002-10-01), Kono
patent: 6474531 (2002-11-01), Ozawa

Affiliated with

Also associated with

Rating

Flip-chip bonding structure and method for making the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Flip-chip bonding structure and method for making the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flip-chip bonding structure and method for making the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3424480