Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2006-03-28
2008-09-30
Nguyen, Dao H (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S634000, C257S702000, C257S758000, C257SE21261, C257SE21273, C428S032850, C428S034200
Reexamination Certificate
active
07429789
ABSTRACT:
A dielectric composition for forming a dielectric layer usable in circuitized substrates such as PCBs, chip carriers and the like, the composition including at least two fluoropolymers and two inorganic fillers. A circuitized substrate including at least one such dielectric layer and at least one conductive layer thereon is also provided.
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Japp Robert M.
Markovich Voya R.
Papathomas Kostas I.
Endicott Interconnect Technologies, Inc.
Fraley Lawrence R.
Hinman, Howard & Kattell LLP
Levy Mark
Nguyen Dao H
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