Fluid cooled encapsulated microelectronic package

Details Fluid cooled encapsulated microelectronic package Fluid cooled encapsulated microelectronic package

2007-01-17

2009-02-03

Pizarro, Marcos D. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257SE23097

Reexamination Certificate

active

07485957

ABSTRACT:
An encapsulated microelectronic package includes a fluid conducting cooling tube directly coupled to one or more semiconductor chips, with the encapsulant being molded over the semiconductor chips and portions of the cooling tube in proximity to the semiconductor chips. The encapsulant immobilizes the cooling tube with respect to the semiconductor chips, and the cooling tube and encapsulant are designed to minimize differences in their coefficients of thermal expansion relative to the semiconductor chips.

REFERENCES:
patent: 3504096 (1970-03-01), Nagel
patent: 4448240 (1984-05-01), Sharon
patent: 7019395 (2006-03-01), Hirano et al.

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