Flip-chip semiconductor device having I/O modules in an...

Details Flip-chip semiconductor device having I/O modules in an... Flip-chip semiconductor device having I/O modules in an...

2005-02-22

2005-02-22

Dang, Phuc T. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S693000, C257S731000

Reexamination Certificate

active

06858924

ABSTRACT:
A semiconductor device includes an internal circuit area including a plurality of I/O modules, and a peripheral area receiving therein a pair of loop test lines for testing I/O buffers in the I/O modules. The internal test line extending from each of the loop test lines toward the internal circuit area includes an out-module test line formed as the topmost layer, a first in-module test line formed as the topmost layer and connected to the out-module test line, and a second in-module test line, a portion of which is formed by connecting the in-buffer test lines together.

REFERENCES:
patent: 5202624 (1993-04-01), Gheewala et al.
patent: 2001-223335 (2001-08-01), None

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