Fluid cooled encapsulated microelectronic package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Reexamination Certificate

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Details

C257S707000, C257S713000, C257SE23098

Reexamination Certificate

active

10919625

ABSTRACT:
An encapsulated microelectronic package includes a fluid conducting cooling tube directly coupled to one or more semiconductor chips, with the encapsulant being molded over the semiconductor chips and portions of the cooling tube in proximity to the semiconductor chips. The encapsulant immobilizes the cooling tube with respect to the semiconductor chips, and the cooling tube and encapsulant are designed to minimize differences in their coefficients of thermal expansion relative to the semiconductor chips.

REFERENCES:
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patent: 5150274 (1992-09-01), Okada et al.
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patent: 5696405 (1997-12-01), Weld
patent: 6600651 (2003-07-01), Weng
patent: 6992382 (2006-01-01), Chrysler et al.
patent: 7019395 (2006-03-01), Hirano et al.
patent: 2004/0066630 (2004-04-01), Whittenburg et al.
patent: 2005/0030717 (2005-02-01), Inagaki et al.
patent: 0709884 (1996-05-01), None
patent: 0401550 (1992-02-01), None
patent: 2002270748 (2002-09-01), None
EP 05 07 6743 European Search Report dated Feb. 2, 2006.

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