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Selected: E

Electronic assembly having a more dense arrangement of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Electronic assembly having a wetting layer on a thermally...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Electronic assembly having an indium thermal couple

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Electronic assembly having electrically-isolated...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Electronic assembly having improved power supply bus voltage...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Electronic assembly including a die having an integrated...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Electronic assembly including heat absorbing material for limiti

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Electronic assembly including multiple substrates

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
Reexamination Certificate

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Electronic assembly providing shunting of electrical current

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Electronic assembly with first and second substrates

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Electronic assembly with high capacity thermal interface

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Electronic assembly with hot spot cooling

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Electronic assembly with integrated IO and power contacts

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Electronic assembly with optimum heat dissipation

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Electronic assembly with solder-bonded heat sink

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Electronic card formed of a double-sided printed circuit...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Reexamination Certificate

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Electronic chip component and method for manufacturing...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Electronic circuit and method with thermal management

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent

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Electronic circuit arrangement and method for producing an...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Electronic circuit card

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Patent

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