Electronic assembly having a more dense arrangement of...
Electronic assembly having a wetting layer on a thermally...
Electronic assembly having an indium thermal couple
Electronic assembly having electrically-isolated...
Electronic assembly having improved power supply bus voltage...
Electronic assembly including a die having an integrated...
Electronic assembly including heat absorbing material for limiti
Electronic assembly including multiple substrates
Electronic assembly providing shunting of electrical current
Electronic assembly with first and second substrates
Electronic assembly with high capacity thermal interface
Electronic assembly with hot spot cooling
Electronic assembly with integrated IO and power contacts
Electronic assembly with optimum heat dissipation
Electronic assembly with solder-bonded heat sink
Electronic card formed of a double-sided printed circuit...
Electronic chip component and method for manufacturing...
Electronic circuit and method with thermal management
Electronic circuit arrangement and method for producing an...
Electronic circuit card