Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2006-11-07
2006-11-07
Williams, Alexander Oscar (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257SE25031, C257SE23106, C257SE23145, C257SE23089, C257SE23145, C257SE23064, C257SE23065, C257SE23070, C257SE23145, C257S712000, C257S717000, C257S720000, C257S710000, C257S704000, C257S686000, C257S723000, C257S685000, C361S784000
Reexamination Certificate
active
07132746
ABSTRACT:
A process and electronic assembly for conducting heat from a semiconductor circuit device mounted to a substrate. The substrate is supported by a housing member equipped with a heat-conductive member. A surface of the device opposite the substrate is bonded to the heat-conductive member with a solder joint formed of indium and optionally one or more alloying constituents that increase the melting temperature of the solder joint above that of indium. The housing member, substrate, and device are assembled so that an indium-containing solder material is present between the heat-conductive member and the surface of the device opposite the substrate. The solder material is then reflowed to form the solder joint. The alloying constituent(s) are preferably introduced into the solder joint during reflow.
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Brandenburg Scott D.
Myers Bruce A.
Delphi Technologies Inc.
Funke Jimmy L.
Williams Alexander Oscar
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