Electronic circuit arrangement and method for producing an...

Details Electronic circuit arrangement and method for producing an... Electronic circuit arrangement and method for producing an...

2011-03-22

2011-03-22

Clark, Jasmine J (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S705000, C257S706000, C257S707000, C257S711000, C257S685000, C257S723000, C257SE25005, C257SE25011, C257SE25012, C257SE25016, C257SE25020, C257SE25026, C257SE23001, C257SE23051, C257SE23103

Reexamination Certificate

active

07911051

ABSTRACT:
An electronic circuit arrangement includes a heat sink and a first circuit carrier which is thermally coupled to the heat sink, lies flat on the latter and is intended to wire electronic components of the circuit arrangement. Provided for at least one electronic component is a special arrangement which is associated with a considerably increased heat dissipation capability for the relevant component and, in addition, also affords further advantages in connection with changes in the population and/or line routing which might occur in practice. The important factor for this is that the component is arranged under a second circuit carrier which is held in a recess in the first circuit carrier. The recess passes through to the top side of the heat sink.

REFERENCES:
patent: 5297006 (1994-03-01), Mizukoshi
patent: 5856911 (1999-01-01), Riley
patent: 2002/0008963 (2002-01-01), Dibene, II et al.
patent: 2005/0152117 (2005-07-01), Belady et al.
patent: 4030532 (1992-04-01), None
patent: 19859739 (2000-07-01), None
patent: 0219627 (1991-06-01), None

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