Electronic assembly with first and second substrates

Details Electronic assembly with first and second substrates Electronic assembly with first and second substrates

1992-02-26

1994-06-07

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257701, 257723, 257724, H01L 2302

Patent

active

053192435

ABSTRACT:
In an electronic assembly whose components or circuit components are combined into at least two sub-assemblies or function units, one or more of the sub-assemblies or function units are disposed on a first substrate comprising a first substrate material. The first substrate is in its turn disposed with one or more further sub-assemblies or function units on a second substrate comprising a second substrate material.

REFERENCES:
patent: 4783695 (1988-11-01), Eichelberger
patent: 4907068 (1990-03-01), Amann et al.
patent: 5052005 (1991-09-01), Tanaka et al.
Nigel Gardner et al., "Gewinn durch Oberflachenmontage"; in der elektroniker, Nr. 4, 1987, pp. 41-46.
Gerhard Taubitz "Miniaturleiterplatten fur die moderne Mikroelektronik"; in Elektronik, 23/Nov. 16, 1984 pp. 125-129.
W. Martin et al., "DCB-Substrate fur die Leistungselektronik-Eigenschaften und Anwendungen"; in Sonderteil in Hanser-Fachzeitschriften, Nov. 1990, pp. ZM198-204.
Jerry Lymann, "Thick And Thin Film Battle For Growing Hybrid Market"; in Electronics, H. 28, Aug. 7, 1986, pp. 88-92.
I. Feinberg et al., "Interposer For Chip-On-Chip Module Attachment"; in IBM Disclosure Bulletin, vol. 26, No. 9, Feb. 1984, pp. 4590-4591.

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