Electronic assembly including multiple substrates

Details Electronic assembly including multiple substrates Electronic assembly including multiple substrates

2007-04-17

2007-04-17

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Entirely of metal except for feedthrough

C257S700000, C257S706000, C257S707000, C257S708000, C257S710000, C257S711000, C257S712000, C257S713000, C257S635000, C257S747000, C257S734000, C257S739000, C257SE39009, C257SE31131, C257SE39018

Reexamination Certificate

active

11088101

ABSTRACT:
An electronic assembly includes a first substrate and a second substrate. The first substrate includes a first surface having a first plurality of conductive traces formed on an electrically non-conductive layer. The second substrate includes a first surface having a second plurality of conductive traces formed thereon and a second surface having a third plurality of conductive traces formed thereon. A first electronic component is electrically coupled to one or more of the plurality of conductive traces on the first surface of the second substrate. At least one of a plurality of conductive interconnects is incorporated within each solder joint that electrically couples one or more of the conductive traces formed on the second surface of the second substrate to one or more of the conductive traces formed on the first substrate.

REFERENCES:
patent: 6365978 (2002-04-01), Ibnabdeljalil et al.
patent: 2004/0140544 (2004-07-01), Naka et al.
patent: 2004/0238942 (2004-12-01), Chakravorty et al.

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