Electronic chip component and method for manufacturing...

Details Electronic chip component and method for manufacturing... Electronic chip component and method for manufacturing...

2006-03-28

2006-03-28

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S730000, C257S736000, C257S750000

Reexamination Certificate

active

07019396

ABSTRACT:
An electronic chip component includes a component body and a plurality of terminal electrodes disposed on outer surfaces of the component body. At least one of the terminal electrodes includes a cured resin film including dispersed conductive particles, an outer conductive film formed on the cured resin film by electroplating, and additional conductive metallic particles being dispersed on an interface between the cured resin film and the outer conductive film.

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patent: 6548437 (2003-04-01), Sato et al.
patent: 6853074 (2005-02-01), Kitae et al.
patent: 2001/0026017 (2001-10-01), Seto
patent: 2002/0020896 (2002-02-01), Ishikawa et al.
patent: 11-283866 (1999-10-01), None

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