Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2005-04-19
2005-04-19
Smith, Matthew (Department: 2825)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S707000, C257S714000, C257S720000
Reexamination Certificate
active
06882043
ABSTRACT:
According to one aspect of the invention a method of constructing an electronic assembly is provided. The electronic assembly is constructed from a semiconductor package including a package substrate and a semiconductor chip mounted to the package substrate, a thermally conductive member, and a substance including indium. The method comprises securing the thermally conductive member and the semiconductor package in a selected orientation relative to one another with the thermally conductive member on a side of the semiconductor chip opposing the package substrate and with the substance located between the semiconductor chip and at least a portion of the thermally conductive member. The substance is thermally coupled to the semiconductor chip on one side and thermally coupled to the portion of the thermally conductive member on an opposing side.
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Churilla Paul W.
Dishongh Terrance J.
Pullen David H.
Blakely , Sokoloff, Taylor & Zafman LLP
Intel Corporation
Luu Chuong Anh
Smith Matthew
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