Electronic assembly having a more dense arrangement of...

Details Electronic assembly having a more dense arrangement of... Electronic assembly having a more dense arrangement of...

2007-10-16

2007-10-16

Huynh, Andy (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S690000, C257S734000, C257S773000, C257S778000, C361S760000, C361S777000, C174S260000, C174S261000

Reexamination Certificate

active

10994057

ABSTRACT:
An electronic assembly is described, having a substrate and contacts on the substrate which are spaced and arranged in a manner that allows for a more dense arrangement of contacts but still allows for routing of traces between the contacts.

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