Electronic assembly including heat absorbing material for limiti

Details Electronic assembly including heat absorbing material for limiti Electronic assembly including heat absorbing material for limiti

1993-05-14

1994-05-24

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257720, H01L 2302

Patent

active

053151542

ABSTRACT:
A solid polyhydric alcohol material (16) is provided in thermal contact with an electronic component (14) which will be damaged if its temperature rises above a certain value. The material (16), known as a phase change material (PCM), exhibits an isothermal solid-solid phase transition at a predetermined temperature (T1) below which damage to the component (14) will not occur. Heat generated by the component (14) and its environment causes the temperature of the component (14) and the PCM (16) to increase to the transition temperature (T1). Further generated heat is absorbed by the PCM (16) as latent heat and causes a phase transition, such that no further increase in temperature occurs. This arrangement prevents the temperature of the component (14) from rising above the transition temperature (T1) under transient thermal overload conditions.

REFERENCES:
patent: 4816173 (1989-03-01), Achard et al.
patent: 4994903 (1991-02-01), Wroe et al.
patent: 5194928 (1993-03-01), Cronin et al.
"Solid State Phase Change Materials For Thermal Energy Storage In Passive Solar Heated Building", D. Benson et al., Sep. 1984, U.S. Department of Energy reprot No. SERI/TP-255-2494 (DE85000535).

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