LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package,With contact or lead

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ceramic embedded wireless antenna

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ceramic microelectronics package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ceramic multilayer substrate and method for manufacturing...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ceramic package and chip resistor, and methods for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ceramic-glass IC package assembly having multiple conductive lay

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ceramic-metal composite structure and process of producing same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Chip array with two-sided cooling

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Chip carrier for a high-frequency electronic package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Chip carrier having a specific power join distribution structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Chip carrier structure having semiconductor chip embedded...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Chip carrier substrate with a land grid array and external...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Chip carrier with embedded leads and chip package using same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Chip carrier, semiconductor package and fabricating method...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Chip embedded package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Chip holder with wafer level redistribution layer

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Chip module with a plurality of flat contact elements...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Chip on board leadframe for semiconductor components having...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Chip on board package with top and bottom terminals

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Chip package and method for fabricating the same