Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2006-08-29
2006-08-29
Cao, Phat X. (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S703000, C438S125000
Reexamination Certificate
active
07098532
ABSTRACT:
A ceramic package and a chip resistor obtained by forming, on a plastic ceramic green sheet comprising 100 parts by weight of a ceramic powder mainly composed of borosilicate glass, into which 10 to 30 parts by weight of an acrylic copolymer obtained by polymerizing 100 parts by weight of a (meth)acrylic acid ester and 1 to 10 parts by weight of a monomer having a functional group of a hydroxyl group, acid amide group, or amino group and having a Tg in the range of −30° C. to +10° C. is compounded, a conductor layer using a plastic conductive paste obtained by compounding, into 100 parts by weight of a conductive powder, 5 to 20 parts a mixture of an acrylic copolymer having a Tg of not more than −30° C. and an ethylcellulose-based binder, press forming the resultant single layer of ceramic green sheet, and calcining the resultant ceramic green sheet having the integrally formed bottom, opening and opening circumferential edge and a method for producing the same.
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International Search Report for PCT/JP03/14753 mailed on Mar. 9, 2004.
Ishita Fumio
Naito Junya
Shibata Atsushi
Yamagata Noboru
Cao Phat X.
Doan Theresa T.
Nippon Carbide Kogyo Kabushiki Kaisha
Rader & Fishman & Grauer, PLLC
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