Ceramic package and chip resistor, and methods for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

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C257S703000, C438S125000

Reexamination Certificate

active

07098532

ABSTRACT:
A ceramic package and a chip resistor obtained by forming, on a plastic ceramic green sheet comprising 100 parts by weight of a ceramic powder mainly composed of borosilicate glass, into which 10 to 30 parts by weight of an acrylic copolymer obtained by polymerizing 100 parts by weight of a (meth)acrylic acid ester and 1 to 10 parts by weight of a monomer having a functional group of a hydroxyl group, acid amide group, or amino group and having a Tg in the range of −30° C. to +10° C. is compounded, a conductor layer using a plastic conductive paste obtained by compounding, into 100 parts by weight of a conductive powder, 5 to 20 parts a mixture of an acrylic copolymer having a Tg of not more than −30° C. and an ethylcellulose-based binder, press forming the resultant single layer of ceramic green sheet, and calcining the resultant ceramic green sheet having the integrally formed bottom, opening and opening circumferential edge and a method for producing the same.

REFERENCES:
patent: 5644163 (1997-07-01), Tsuji
patent: 5822851 (1998-10-01), Yamasaki et al.
patent: 07-221454 (1995-08-01), None
patent: 2000-040878 (2000-02-01), None
patent: 2001-002475 (2001-01-01), None
patent: 2001-144227 (2001-05-01), None
patent: 2001-181023 (2001-07-01), None
International Search Report for PCT/JP03/14753 mailed on Mar. 9, 2004.

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