Chip carrier having a specific power join distribution structure

Details Chip carrier having a specific power join distribution structure Chip carrier having a specific power join distribution structure

1998-10-19

2000-05-02

Hardy, David

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257738, 257786, H01L 2348

Patent

active

060575964

ABSTRACT:
A chip carrier for carrying a chip is disclosed. The chip carrier includes a substrate having a first surface for mounting therein the chip wherein the substrate has a plurality of through holes and a plurality of conducting lines, a plurality of grounded joints set at a corresponding position of a second surface of the substrate under the chip and electrically connected to the chip by the plurality of conducting lines through the plurality of through holes for grounding, a plurality of signal joints surrounding the plurality of grounded joints on the second surface of the substrate and electrically connected to the chip by the plurality of conducting lines through the plurality of through holes for transmitting a series of signals, and a plurality of power joints set between the grounded joints and the signal joints and electrically connected to the chip by the plurality of conducting lines through the plurality of through holes for energizing the chip wherein there exists spaces among the ground joints, the signal joints, and the power joints.

REFERENCES:
patent: 4746966 (1988-05-01), Fitzgerald et al.
patent: 5632631 (1997-05-01), Fjelstad et al.
patent: 5641988 (1997-06-01), Huang et al.
patent: 5796169 (1998-08-01), Dockerty et al.
patent: 5895968 (1999-04-01), Barber

Affiliated with

Also associated with

Rating

Chip carrier having a specific power join distribution structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chip carrier having a specific power join distribution structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chip carrier having a specific power join distribution structure will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1595946