Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2006-10-17
2006-10-17
Chen, Shih-Chao (Department: 2821)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C343S7000MS
Reexamination Certificate
active
07122891
ABSTRACT:
Apparatus and methods of fabricating antennae embedded within a ceramic material, such as a low temperature co-fired ceramic. Such ceramic material has a low coefficient of thermal expansion which reduces expansion and contraction stresses that can cause the signal transmission frequency to change and thereby affecting proper signal transmission.
REFERENCES:
patent: 6284080 (2001-09-01), Haq et al.
patent: 6556169 (2003-04-01), Fukuura et al.
patent: 6582979 (2003-06-01), Coccioli et al.
patent: 6770159 (2004-08-01), Tebbe et al.
patent: 6784765 (2004-08-01), Yamada et al.
patent: 2004/0257279 (2004-12-01), Tebbe et al.
W. Kinzy Jones et al., “Enhanced Thermal Conductivity in Low Temperature Cofire Ceramic (LTCC) Using Thick Silver Tape,” Proceedings of IPACK '01, The Pacific Rim/ASME International Electronic Packaging.
Technical Conference and Exhibition, Jul. 8-13, 2001, pp. 1-8, Kauai, Hawaii, USA, Ref. No. IPACK2001-15698.
Dishongh Terrance
Pearson Tom E.
Roth Weston C.
Searls Damion T.
A Minh Dieu
Chen Shih-Chao
Intel Corporation
Winkle Robert G.
LandOfFree
Ceramic embedded wireless antenna does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Ceramic embedded wireless antenna, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ceramic embedded wireless antenna will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3651140