Ceramic multilayer substrate and method for manufacturing...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

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C257S700000, C257S698000

Reexamination Certificate

active

06965161

ABSTRACT:
A ceramic multilayer substrate is formed by vertically stacking and firing a plurality of ceramic sheets, in which a connection bar is vertically formed between internal patterns and an external terminal of each ceramic sheet, preventing metallic conductive layers of the internal patterns from being deformed during processing the external terminal. The ceramic multilayer substrate has pattern layers formed on surfaces of at least some of the ceramic sheets. At least one through hole is formed on the edges of the stacked ceramic sheets so as to be opened to the outside. An external terminal is formed on an inner wall of the through hole connected with the pattern layers, and directly contacting the connection bar, whereby the connection bar supports the electrical connection between the external terminal and the pattern layers.

REFERENCES:
patent: 6041496 (2000-03-01), Haq et al.
patent: 6311390 (2001-11-01), Abe et al.
patent: 2002/0064029 (2002-05-01), Pohjonen
patent: 2003/0128096 (2003-07-01), Mazzochette
patent: 02-166792 (1990-06-01), None
patent: 5-327222 (1993-12-01), None
patent: 08-037251 (1996-02-01), None

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