Ceramic-glass IC package assembly having multiple conductive lay

Details Ceramic-glass IC package assembly having multiple conductive lay Ceramic-glass IC package assembly having multiple conductive lay

1992-11-12

1994-03-08

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257691, H01L 2302, H01L 2312, H01L 3902, H01L 2329

Patent

active

052930696

ABSTRACT:
A ceramic base of an IC package has a laminated structure and has two conductive layers sandwiched between insulating ceramic layers. One of the conductive layers is used as a power source layer and electrically connects a plurality of power source terminals of an IC chip to a single power source lead. The other conductive layer is used as an earth layer and electrically connects a plurality of earth terminals of the IC chip to a single earth lead.

REFERENCES:
patent: 4608592 (1986-08-01), Miyamoto
patent: 4814943 (1989-03-01), Okuaki
patent: 4827327 (1989-05-01), Miyauchi et al.
patent: 4890155 (1989-12-01), Miyagawa et al.
patent: 4922324 (1990-05-01), Sudo
patent: 4949163 (1990-08-01), Sudo et al.
patent: 4992628 (1991-02-01), Beppu et al.
patent: 5095359 (1992-03-01), Tanaka et al.
patent: 5134246 (1992-07-01), Beppu et al.

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