Ceramic electronic package design

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

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Details

257700, 257704, 257705, H01L 2302

Patent

active

051683440

ABSTRACT:
Hermetic package designs for HDMI substrates are discussed. The designs for a hermetically sealed, perimeter-leaded package may have the following features:

REFERENCES:
patent: 4076955 (1978-02-01), Gates, Jr.
patent: 4340902 (1982-07-01), Honda et al.
patent: 4649417 (1987-03-01), Burgess et al.
patent: 4695872 (1987-09-01), Chatterjee
patent: 4999700 (1991-03-01), Dunaway et al.

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