LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package,With contact or lead

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Bottom lead semiconductor chip stack package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Bottom lead semiconductor package having folded leads

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Bow control in an electronic package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Bow control in an electronic package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Build-up board package for semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Buried array capacitor and microelectronic structure...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Buried ground plane for high performance system modules

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

C4 substrate contact pad which has a layer of Ni-B plating

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Capacitance type semiconductor sensor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Capacitance type semiconductor sensor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Capacitor embedded in interposer, semiconductor device...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Capacitor-built-in type printed wiring substrate, printed...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Capacitor-built-in type printed wiring substrate, printed...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Carrier, method of manufacturing a carrier and an electronic...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Castellation wafer level packaging of integrated circuit chips

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Cavity ball grid array apparatus

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Cavity down plastic ball grid array multi-chip module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Cavity semiconductor package with exposed leads and die pad

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ceramic chip-type electronic component and method of making...