C4 substrate contact pad which has a layer of Ni-B plating

Details C4 substrate contact pad which has a layer of Ni-B plating C4 substrate contact pad which has a layer of Ni-B plating

1996-06-24

1998-05-26

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257778, 257783, 437108, H01L 2348, H01L 2352, H01L 2940

Patent

active

057570710

ABSTRACT:
A flip chip integrated circuit package which has a layer of nickel-boron (Ni--B) on the contact pads of the package substrate and a layer of nickel-phosphorus (Ni--P) on the pins of the substrate. A layer of gold is plated onto the layers of nickel. An integrated circuit with a plurality of solder bumps is placed onto the contact pads of the substrate. The package is heated to reflow the solder bumps, gold and nickel-boron into solder joints that attach the integrated circuit to the substrate. The package is then typically shipped and mounted to a printed circuit board by soldering the pins to the board.

REFERENCES:
patent: 3977840 (1976-08-01), Estep et al.
patent: 4323914 (1982-04-01), Berndlmaier et al.
patent: 5089881 (1992-02-01), Panicker
patent: 5436412 (1995-07-01), Ahmad et al.
patent: 5468995 (1995-11-01), Higgins, III

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