Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1998-09-03
2000-07-04
Hardy, David
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257693, 257701, 257702, 257678, H01L 23053, H01L 2348, H01L 2302
Patent
active
060842970
ABSTRACT:
A ball grid array (BGA) package includes a central cavity for receiving a semiconductor die therein. The die rests on a base laminate, the die side of which includes traces therein extending into the cavity, which is framed at least by an anisotropically-conductive adhesive layer. Bond pads on the die are electrically connected, as by wire bonds or, in the case of a flip-chip configured die, solder balls or conductive adhesive elements, to the traces. The traces are, in turn, electrically connected through conductive vias to conductive element sites on the opposite side of the base laminate through a dielectric layer, the conductive element sites carrying solder balls or other discrete conductive bonding elements for connection to higher-level packaging. A ground or other reference voltage plane, which is also electrically connected to at least one trace through the anisotropically-conductive adhesive layer, may extend over the adhesive layer and frame the cavity, or also extend over the cavity to provide an enclosure for the die. In the former case, an encapsulant is applied over the die and electrical connections to the traces.
REFERENCES:
patent: 5397921 (1995-03-01), Karnezos
patent: 5409865 (1995-04-01), Karnezos
patent: 5455456 (1995-10-01), Newman
patent: 5490324 (1996-02-01), Newman
patent: 5563446 (1996-10-01), Chia et al.
patent: 5586010 (1996-12-01), Murtuza et al.
patent: 5594275 (1997-01-01), Kwon et al.
patent: 5596227 (1997-01-01), Saito
patent: 5598033 (1997-01-01), Behlen et al.
patent: 5598036 (1997-01-01), Ho
patent: 5598321 (1997-01-01), Mostafazadeh et al.
patent: 5708567 (1998-01-01), Shim et al.
patent: 5763939 (1998-06-01), Yumashita
patent: 5896276 (1999-04-01), Tamura et al.
patent: 5909058 (1999-06-01), Yano et al.
Brooks Jerry M.
Thummel Steven G.
Clark Jhihan B
Hardy David
Micro)n Technology, Inc.
LandOfFree
Cavity ball grid array apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Cavity ball grid array apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cavity ball grid array apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1489033