Carrier, method of manufacturing a carrier and an electronic...

Details Carrier, method of manufacturing a carrier and an electronic... Carrier, method of manufacturing a carrier and an electronic...

2007-07-24

2007-07-24

Zameke, David A. (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257SE23060

Reexamination Certificate

active

10510588

ABSTRACT:
The carrier (30) comprises a first etch mask (14), a first metal layer (11), an intermediate layer (12), a second metal layer (13) and a second etch mask (17). Both the first and the second etch mask (14, 17) can be provided in one step by means of electrochemical plating. After the first metal layer (11) and the intermediate layer (12) have been patterned through the first etch mask (14), an electric element (20) can be suitably attached to the carrier (30) using conductive means. In this patterning operation, the intermediate layer (12) is etched further so as to create underetching below the first metal layer (11). After the provision of an encapsulation (40), the second metal layer (13) is patterned through the second etch mask (17). In this manner, a solderable device (10) is obtained without a photolithographic step during the assembly process.

REFERENCES:
patent: 6306685 (2001-10-01), Liu et al.
patent: 6351025 (2002-02-01), Ohsawa et al.
patent: 6451627 (2002-09-01), Coffman

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