Cavity down plastic ball grid array multi-chip module

Details Cavity down plastic ball grid array multi-chip module Cavity down plastic ball grid array multi-chip module

1999-05-27

2000-10-03

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257723, 257678, 257693, 257712, 257703, H01L 2352

Patent

active

061277266

ABSTRACT:
A circuit assembly comprising a substrate, a first set of contacts, a second set of contacts, and a third set of contacts. Also, a plurality of electrically conductive lines located on the substrate providing electrical connection between the first set of contacts, the second set of contacts, and the third set of contacts, wherein the plurality of electrically conductive lines are configured such that data can be transferred between the first set of contacts, the second set of contacts and the third set of contacts. A first die is electrically connected to the first set of contacts, and a molding compound surrounds the substrate, wherein the molding compound is formed such that the second set of contacts is exposed allowing electrical connection of the second die to the second set of contacts.

REFERENCES:
patent: 5239198 (1993-08-01), Lin et al.
patent: 5869894 (1999-02-01), Degani et al.

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