LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package,With contact or lead

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Assembly of semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Attaching semiconductor dies to substrates with conductive...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Axial lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Backside exposure of desired nodes in a multi-layer integrated c

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball array layout

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball array layout in chip assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball assignment schemes for integrated circuit packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid array (BGA) semiconductor package member

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid array arrangement

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid array copper balancing

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid array electronic package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid array package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid array package employing raised metal contact rings

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid array package having a deformable metal layer and meth

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid array package having electrodes on peripheral side sur

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid array package semiconductor device having improved...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid array semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid array semiconductor package and substrate without...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid array semiconductor package with improved strength...