Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1998-07-01
1999-04-20
Whitehead, Jr., Carl
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257706, 257778, 257780, H01L 2352
Patent
active
058959670
ABSTRACT:
A ball grid array package (62) having a deformable metal layer (20) is provided that includes a heat spreader (60), a stiffener (40) having a cavity and mounted to the heat spreader (60), a substrate (22), and a die (50). The substrate (22) includes a dielectric layer (10) with a cavity and cut-outs, the deformable metal layer (20), and a plurality of electrical traces for connection to solder balls. The dielectric layer (10) couples to the stiffener (40) through a second side and to the deformable metal layer (20) through the first side. The deformable metal layer (20) includes a cavity, a power ring (26), a ground ring (24), and a plurality of traces serving as either a ground connection, a signal connection, or a power connection for coupling with the plurality of solder balls. The deformable metal layer (20) also has a plurality of deformable metal layer portions each partially positioned over one of the cut-outs in the dielectric layer (10) and electrically coupled to the stiffener (40) through the cut-out. Each of the plurality of deformable metal layer portions also couples with one or more of the plurality of traces. The die (50) is mounted to the heat spreader (60) through the cavity of the substrate (22) and the stiffener (40). The present invention also provides a method for forming the ball grid array package (62).
REFERENCES:
patent: 5763947 (1998-06-01), Bartley
patent: 5777265 (1998-07-01), Bhattacharyya et al.
patent: 5796170 (1998-08-01), Marcantonio
patent: 5798571 (1998-08-01), Nakajima
Hassanzadeh Nozar
Kalidas Navinchandra
Stearns William P.
Brady III W. James
Clark S. V.
Courtney Mark E.
Donaldson Richard L.
Jr. Carl Whitehead
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