Ball grid array package having electrodes on peripheral side sur

Details Ball grid array package having electrodes on peripheral side sur Ball grid array package having electrodes on peripheral side sur

1997-09-05

2000-11-07

Hardy, David

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257690, 257692, 257698, 257775, H01L 2348

Patent

active

061440906

ABSTRACT:
A ball grid array package includes a package board having a bottom surface, a top surface, and peripheral side surfaces, the bottom surface having solder ball pads provided thereon, the top surface having wire bonding pads provided thereon. A semiconductor chip is contained on the package board and electrically connected to the wire bonding pads. Solder balls are arrayed in a grid formation on the bottom surface of the package board and respectively soldered to the solder ball pads of the package board. Electrodes are provided on the peripheral side surfaces of the package board, each electrode having a first portion provided on one of the peripheral side surfaces, a second portion provided on the top surface and a third portion provided on the bottom surface. Wiring patterns are provided between the bottom surface and the top surface of the package board, electrically connecting the wire bonding pads with the second portions of the electrodes, and electrically connecting the solder ball pads with the third portions of the electrodes. The semiconductor chip is electrically connected to the solder ball pads through the electrodes and the wiring patterns.

REFERENCES:
patent: 5248347 (1993-09-01), Ochi
patent: 5293067 (1994-03-01), Thompson et al.
patent: 5388029 (1995-02-01), Moriyama
patent: 5468999 (1995-11-01), Lin et al.
patent: 5541450 (1996-07-01), Jones et al.
patent: 5689091 (1997-11-01), Hamzehdoost et al.
Technology Disclosure Report No. 84-013671, vol. 9-50, Nov. 20, 1984.

Affiliated with

Also associated with

Rating

Ball grid array package having electrodes on peripheral side sur does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Ball grid array package having electrodes on peripheral side sur, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ball grid array package having electrodes on peripheral side sur will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1644092