Array capacitors in interposers, and methods of using same

Details Array capacitors in interposers, and methods of using same Array capacitors in interposers, and methods of using same

2006-08-22

2006-08-22

Owens, Douglas W (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S703000, C438S109000, C438S125000

Reexamination Certificate

active

07095108

ABSTRACT:
A chip package is made with the ring or dish interposer and an embedded array capacitor. A computing system is also disclosed that includes the ring or dish interposer and the embedded array capacitor.

REFERENCES:
patent: 6532143 (2003-03-01), Figueroa et al.
patent: 2003/0193093 (2003-10-01), Brofman et al.
patent: 2004/0184219 (2004-09-01), Otsuka et al.

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