Ball grid array semiconductor package

Details Ball grid array semiconductor package Ball grid array semiconductor package

1998-09-18

1999-10-19

Chaudhuri, Olik

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257676, 257735, 257736, 257784, 257787, H01L 2348, H01L 23495, H01L 2328

Patent

active

059694165

ABSTRACT:
A ball grid array semiconductor package including a semiconductor chip, at least one lead having one end attached to the semiconductor chip and other end bent at a predetermined angle, a wire connecting the bent lead to an electrode formed on the semiconductor chip, a first bump attached to a bent end portion of the bent lead, and a resin molding enclosing the semiconductor chip, the lead and the wire to allow one side surface of the bump to be exposed out of the resin molding.

REFERENCES:
patent: 5157480 (1992-10-01), McShane et al.
patent: 5172214 (1992-12-01), Casto
patent: 5302849 (1994-04-01), Cavasin
patent: 5363279 (1994-11-01), Cha
patent: 5519251 (1996-05-01), Sato et al.
patent: 5684330 (1997-11-01), Lee
patent: 5834837 (1998-11-01), Song

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