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Hole geometry of a semiconductor package substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Housing for a semiconductor component

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Housing for semiconductor chips

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Hybrid frame with lead-lock tape

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Hybrid integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Hybrid integrated circuit device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Hybrid integrated circuit device, and method for fabricating...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Hybrid integrated circuit device, and method for fabricating...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Hybrid integrated circuit device, and method for fabricating...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Hybrid integrated circuit device, and method for fabricating...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Hybrid module and method of manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Hybrid package including a power MOSFET die and a control and pr

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Hydrophobic foamed insulators for high density circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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I/O architecture for integrated circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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I/O pin having solder dam for connecting substrates

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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IC chip, antenna, and manufacturing method of the IC chip...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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IC die power connection using canted coil spring

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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IC package and LSI package using a lead frame formed of a copper

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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IC package having a single wiring sheet with a lead pattern disp

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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IC package structure for achieving better heat dissipation

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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