Hole geometry of a semiconductor package substrate
Housing for a semiconductor component
Housing for semiconductor chips
Hybrid frame with lead-lock tape
Hybrid integrated circuit
Hybrid integrated circuit device
Hybrid integrated circuit device, and method for fabricating...
Hybrid integrated circuit device, and method for fabricating...
Hybrid integrated circuit device, and method for fabricating...
Hybrid integrated circuit device, and method for fabricating...
Hybrid module and method of manufacturing the same
Hybrid package including a power MOSFET die and a control and pr
Hydrophobic foamed insulators for high density circuits
I/O architecture for integrated circuit package
I/O pin having solder dam for connecting substrates
IC chip, antenna, and manufacturing method of the IC chip...
IC die power connection using canted coil spring
IC package and LSI package using a lead frame formed of a copper
IC package having a single wiring sheet with a lead pattern disp
IC package structure for achieving better heat dissipation