Housing for a semiconductor component

Details Housing for a semiconductor component Housing for a semiconductor component

2009-07-20

2011-11-22

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S666000, C257S696000, C257SE23031, C257SE23042, C257SE23043

Reexamination Certificate

active

08063479

ABSTRACT:
A housing for a semiconductor component, in which the housing has a plurality of pins which are provided at the edge of the housing at distances, the pins each having a width, a thickness and a length. In order to create a housing for a semiconductor component whose characteristic frequencies are outside a range in which the characteristic frequencies of the housing negatively influence the semiconductor component, either at least one of the distances lies outside the range of 1.24 mm to 1.30 mm, at least one of the widths lies outside the range of 0.33 mm to 0.51 mm, at least one of the thicknesses lies outside the range of 0.23 to 0.32 mm, or at least one of the lengths lies outside the range of 2.05 to 4.12 mm.

REFERENCES:
patent: 5031024 (1991-07-01), Kudo et al.

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