Hybrid integrated circuit

Details Hybrid integrated circuit Hybrid integrated circuit

1994-06-07

1996-04-09

Jackson, Jr., Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257762, 257747, 257693, 257696, 257706, 257753, 257707, 257773, 361773, 361779, 361771, 361772, H01L 2348, H01L 2352

Patent

active

055064477

ABSTRACT:
A hybrid integrated circuit of the invention is formed of an insulation substrate, a thick film conductor printed and sintered on the insulation substrate, and a terminal conductor and a circuit part connected to the first thick film conductor. A first electrically conductive metal plate is brazed on the first thick film conductor and connects the circuit part and the first terminal. Electric current between the circuit part and the first terminal mostly flows through the metal plate.

Affiliated with

Also associated with

Rating

Hybrid integrated circuit does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Hybrid integrated circuit, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hybrid integrated circuit will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-140885