Resin-sealed semiconductor device, manufacturing method...

Details Resin-sealed semiconductor device, manufacturing method... Resin-sealed semiconductor device, manufacturing method...

2007-06-22

2010-12-14

Smith, Matthew S (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S734000, C257SE23010, C438S106000

Reexamination Certificate

active

07851902

ABSTRACT:
The present invention provides a resin-sealed semiconductor device, which includes a semiconductor element; a plurality of terminal members, each surrounding the semiconductor element and including an external terminal portion, an internal terminal portion and a connecting portion; bonding wires, each connecting the semiconductor element with the internal terminal portion; and a resin-sealing portion sealing the semiconductor element, terminal members and bonding wires. Each terminal member is composed of an inner thinned portion forming the internal terminal portion and an outer thickened portion forming the external terminal portion. A rear face of each internal terminal portion, and a front face, a rear face and an outer side face of each external terminal portion are exposed to the outside from the resin-sealing portion, respectively.

REFERENCES:
patent: 6630729 (2003-10-01), Huang
patent: 2004/0232534 (2004-11-01), Seki et al.
patent: 2005/0093117 (2005-05-01), Masuda et al.
patent: 2005/0093118 (2005-05-01), Itou et al.
patent: 2006/0079028 (2006-04-01), Takahashi
patent: 11-260983 (1999-09-01), None
patent: 11-260989 (1999-09-01), None
patent: 11-307675 (1999-11-01), None
patent: 2000-031366 (2000-01-01), None
patent: 2002-033434 (2002-01-01), None
patent: 2003-046054 (2003-02-01), None
patent: 2003-158234 (2003-05-01), None
patent: 2004-319577 (2004-11-01), None
patent: 2004319577 (2004-11-01), None

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