Reference plane of integrated circuit packages

Details Reference plane of integrated circuit packages Reference plane of integrated circuit packages

2005-06-21

2005-06-21

Thai, Luan (Department: 2829)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S692000, C257S774000, C257S773000

Reexamination Certificate

active

06909174

ABSTRACT:
An apparatus including an integrated circuit including a plurality of devices and signal circuitry coupled to the plurality of devices, and a package substrate including a first surface coupled to the integrated circuit, a second surface having a plurality of externally accessible contact points coupled to the signal circuitry, and a continuous layer of conductive material coupled to a reference signal of the integrated circuit and disposed over an area of the second surface and electrically isolated from the contact points.

REFERENCES:
patent: 5557502 (1996-09-01), Banerjee et al.
patent: 5578940 (1996-11-01), Dillon et al.
patent: 5809263 (1998-09-01), Farmwald et al.
patent: 5841715 (1998-11-01), Farmwald et al.
patent: 6064116 (2000-05-01), Akram
patent: 6016472 (2000-11-01), Ali
patent: 6255852 (2001-07-01), Forbes et al.
patent: 6295220 (2001-09-01), Darwish et al.
patent: 6359234 (2002-03-01), Kouda
patent: 6414396 (2002-07-01), Shim et al.
patent: 6532162 (2003-03-01), Schoenborn
Direct Rambus™ RIMM™ Module Design Guide, Version 0.9, Jul. 1999.

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