Reduced thickness semiconductor device with IC packages mounted

Details Reduced thickness semiconductor device with IC packages mounted Reduced thickness semiconductor device with IC packages mounted

1996-11-20

1998-04-28

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257680, 257686, 257723, 257731, 257737, 257777, 257774, H01L 2336, H01L 2504, H01L 2302, H01L 2312

Patent

active

057448620

ABSTRACT:
A semiconductor device of the present invention enables mounting with a reduced thickness and a high density. IC packages (17) are mounted in each opening (12) on both surfaces of a substrate (11) in such a way that package bodies (18) are half accommodated in the opening (12) formed in the substrate (11).

REFERENCES:
patent: 5045921 (1991-09-01), Lin et al.
patent: 5191404 (1993-03-01), Wu et al.
patent: 5239198 (1993-08-01), Lin et al.
patent: 5299094 (1994-03-01), Nishino et al.
patent: 5521992 (1996-05-01), Chun et al.
patent: 5530292 (1996-06-01), Waki et al.
patent: 5545922 (1996-08-01), Golwalkar et al.
patent: 5563773 (1996-10-01), Katsumata
I.B.M Technical Disclosure Bulletin vol. 34, No. 8 Jan. 1992 pp. 97 and 98.

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