Recyclying faulty multi-die packages

Details Recyclying faulty multi-die packages Recyclying faulty multi-die packages

2006-04-03

2009-08-04

Dang, Phuc T (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S690000, C257S691000, C365S185110, C365S185180

Reexamination Certificate

active

07569923

ABSTRACT:
The present invention teaches the recycling of a faulty multi-die memory package by isolating the functional part of the package and using it as a smaller memory package.

REFERENCES:
patent: 6262926 (2001-07-01), Nakai
patent: 6434044 (2002-08-01), Gongwer et al.
patent: 6956769 (2005-10-01), Lee
patent: 7308524 (2007-12-01), Grundy et al.
patent: 2006/0097284 (2006-05-01), Ronen

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