Resin-sealed type semiconductor device and method for manufactur

Details Resin-sealed type semiconductor device and method for manufactur Resin-sealed type semiconductor device and method for manufactur

1996-07-19

1997-09-30

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257780, 257735, 257738, 257730, H01L 2160, H01L 2348, H01L 2312

Patent

active

056729120

ABSTRACT:
A resin-sealed type semiconductor device comprising a semiconductor chip having an electrode pad, a wiring component composed of a wiring layer formed on one side of an insulating board, a through-hole penetrating through the insulating board and a projecting electrode formed on the other side of the insulating board and at the position corresponding to the through-hole, wherein the semiconductor chip and the wiring component are disposed so that the electrode pad and the projecting electrode are welded together, and at least the gap between the semiconductor chip and the wiring component is sealed with a resin.

REFERENCES:
patent: 4710798 (1987-12-01), Marcantonio
patent: 5172303 (1992-12-01), Bernardoni et al.
patent: 5239198 (1993-08-01), Lin et al.
patent: 5281151 (1994-01-01), Arima et al.
patent: 5521435 (1996-05-01), Mizukoshi

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