Resin molded type semiconductor device having a conductor film

Details Resin molded type semiconductor device having a conductor film Resin molded type semiconductor device having a conductor film

1991-05-21

1993-07-20

Carroll, J.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257207, 257637, 257640, 257642, 257775, 257787, H01L 2702, H01L 2934, H01L 2348, H01L 2944

Patent

active

052296423

ABSTRACT:
A resin molded type semiconductor device has a metallic guard ring that is formed to cover the peripheral edge of the surface of a tetragonal semiconductor substrate. In order to prevent a passivation film on the guard ring from being cracked by stresses due to a resin mold package concentrating in the four corners of the semiconductor substrate, slits or rows of small holes are formed in the corner portions of the guard ring.

REFERENCES:
patent: 3538398 (1970-11-01), Whiting
patent: 3675091 (1972-07-01), Naomoto et al.
patent: 3766448 (1973-10-01), Luce et al.
patent: 4242698 (1980-12-01), Ghate et al.
patent: 4248920 (1981-02-01), Yoshizumi et al.
patent: 4365264 (1982-12-01), Mukai et al.
"IIL (I.sup.2 L) Device: Video-Type Player and TV Set (Example 2)" Yoshihiro Nakano et al. pp. 47-51 (1978); English translation pp. 1 to 11.

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