LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Encapsulated

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Method of reducing memory card edge roughness by edge coating

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Method to improve internal package delamination and wire bond re

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Microelectronic assembly with pre-disposed fill material and...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Microelectronic device package filled with liquid or...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Microelectronic devices having intermediate contacts for...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Microelectronic package including a polymer encapsulated die

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Micromechanical component having an anodically bonded cap...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Module component

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Mold and method for manufacturing a package for a semiconductor

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Mold gates and tape substrates including the mold gates

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant

Molded circuit package having heat dissipating post

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Molded package and semiconductor device using molded package

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Molded package for semiconductor devices with leadframe locking

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Molded packaging for semiconductor device and method of manufact

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Molded plastic package with wire protection

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Molded plastic semiconductor package including an aluminum alloy

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant

Molded plastic semiconductor package including heat spreader

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Molding composition and method, and molded article

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Molding die set and semiconductor device fabricated using...