Molded plastic semiconductor package including heat spreader

Details Molded plastic semiconductor package including heat spreader Molded plastic semiconductor package including heat spreader

1994-07-18

1997-03-04

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With heat sink embedded in encapsulant

257787, 257706, H01L 2328

Patent

active

056082673

ABSTRACT:
There is provided a molded plastic electronic package having improved thermal dissipation. A thermal dissipator, such as a heat spreader or a heat slug is partially encapsulated in the molding resin. The thermal dissipator has a density less than that of copper and a coefficient of thermal conductivity that is constant or increases as the package periphery is approached.

REFERENCES:
patent: 3399332 (1968-08-01), Savolainen
patent: 3770600 (1973-11-01), Sautter et al.
patent: 3784440 (1974-01-01), Grunwald et al.
patent: 3930114 (1975-12-01), Hodge
patent: 4092697 (1978-05-01), Spaight
patent: 4121980 (1978-10-01), Gohausen et al.
patent: 4461924 (1984-07-01), Butt
patent: 4569692 (1986-02-01), Butt
patent: 4589010 (1986-05-01), Tateno et al.
patent: 4640625 (1987-02-01), Kushida
patent: 4707724 (1987-11-01), Suzuki et al.
patent: 4713150 (1987-12-01), Hornbostel et al.
patent: 4766095 (1988-08-01), Hiroshi
patent: 4767674 (1988-08-01), Shirai et al.
patent: 4793967 (1988-12-01), Pryor et al.
patent: 4811166 (1989-05-01), Alvarez et al.
patent: 4840654 (1989-06-01), Pryor
patent: 4882212 (1989-11-01), SinghDeo et al.
patent: 4888449 (1989-12-01), Crane et al.
patent: 4926242 (1990-05-01), Itoh et al.
patent: 4939316 (1990-07-01), Mahulikar et al.
patent: 4994314 (1991-02-01), Rosenfeld et al.
patent: 4996115 (1991-02-01), Eerkes et al.
patent: 5001546 (1991-03-01), Butt
patent: 5013871 (1991-05-01), Mahulikar et al.
patent: 5015083 (1991-05-01), Mahulikar et al.
patent: 5035940 (1991-07-01), Winton et al.
patent: 5043535 (1991-08-01), Lin
patent: 5055967 (1991-10-01), Sukonnik et al.
patent: 5066368 (1991-11-01), Pasqualoni et al.
patent: 5073521 (1991-12-01), Braden
patent: 5096508 (1992-03-01), Breedis et al.
patent: 5098796 (1992-03-01), Lin et al.
patent: 5098864 (1992-03-01), Mahulikar
patent: 5122858 (1992-06-01), Mahulikar et al.
patent: 5124783 (1992-06-01), Sawaya
patent: 5181969 (1993-01-01), Komatsubara et al.
patent: 5188985 (1993-02-01), Medeiros et al.
patent: 5272375 (1993-12-01), Belopolsky
patent: 5300158 (1994-05-01), Chen et al.
patent: 5367196 (1994-11-01), Mahulikar et al.
Metals Handbook, Ninth Edition, vol. 5 "Surface Cleaning, Finishing, and Cleaning", pp. 600-607, 1982.

Affiliated with

Also associated with

Rating

Molded plastic semiconductor package including heat spreader does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Molded plastic semiconductor package including heat spreader, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Molded plastic semiconductor package including heat spreader will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2148209