Micromechanical component having an anodically bonded cap...

Details Micromechanical component having an anodically bonded cap... Micromechanical component having an anodically bonded cap...

2006-08-29

2008-10-14

Soward, Ida M (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

C257S644000, C257S787000, C257S788000, C257S798000

Reexamination Certificate

active

07436076

ABSTRACT:
A micromechanical component includes a cap wafer made up of at least a first silicon substrate and a thin glass substrate, and having a functional wafer made up of at least a second silicon substrate, at least one electrical contact surface being disposed on the functional wafer. the cap wafer is joined at the glass substrate to the functional wafer by anodic bonding. the electrical contact surface is disposed on a side of the functional wafer facing the cap wafer, and the cap wafer has at least one recess, such that an access is provided to the electrical contact surface. A method for encapsulating a micromechanical component having a cap wafer, by anodically bonding the cap wafer to a functional wafer.

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