Molded package for semiconductor devices with leadframe locking

Details Molded package for semiconductor devices with leadframe locking Molded package for semiconductor devices with leadframe locking

1991-10-02

1993-07-06

LaRoche, Eugene R.

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

257678, 257734, 257712, H01L 2328, H01L 2702, H01L 2336

Patent

active

052258971

ABSTRACT:
A molded package with a leadframe locking structure is shown. A lower leadframe consists of a frame member, a connecting element extending therefrom, a mounting member at the distal end of the connecting element, and at least one side element projecting from the mounting member. Electrical connection is made between the mounting member and a semiconductor device. An upper leadframe consists of a frame member and an extending lead element which makes electrical contact with an upper surface of the semiconductor device. There is at least one side element bent up to a predetermined angle relative to the mounting member so that an encapsulant will be locked in place, minimizing the possibility of semiconductor contamination via boundaries between the encapsulant and the leadframes. The encapsulant, such as plastic or epoxy, is transfer or injection molded over the lead element, over the semiconductor device, about the side element, and on top of the mounting member to form the completed package. The leadframes are then removed, leaving a tab extending from the mounting member and a portion of the lead element to serve as electrical leads to the semiconductor device inside.

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