LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Encapsulated

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Latent catalysts for molding compounds

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Reexamination Certificate

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Layer between interfaces of different components in...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Reexamination Certificate

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Lead-free glass tubing, especially for encapsulating diodes...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Reexamination Certificate

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Lead-on-chip type of semiconductor package with embedded...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant

Reexamination Certificate

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Leadless semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Reexamination Certificate

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LED lamp having particular lead arrangement

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Patent

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Light emitting diode with sealant having filling particles

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified filler material

Reexamination Certificate

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Light source

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Reexamination Certificate

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Light-emitting device, planar light source and direct type...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Reexamination Certificate

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Liquid epoxy resin composition and semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Reexamination Certificate

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Liquid resin composition for electronic part sealing, and...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Reexamination Certificate

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Low capacitance coupling wire bonded semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Reexamination Certificate

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Low profile semiconductor package and process for making the...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Reexamination Certificate

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Low stress flip-chip package for low-K silicon technology

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified filler material

Reexamination Certificate

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Low-melting point glass sealed semiconductor device and method o

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Patent

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Low-pin-count chip package and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

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