Method of reducing memory card edge roughness by edge coating

Details Method of reducing memory card edge roughness by edge coating Method of reducing memory card edge roughness by edge coating

2011-08-09

2011-08-09

Zarneke, David A (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

C257S790000, C257SE23119, C257SE23134

Reexamination Certificate

active

07994647

ABSTRACT:
A method of forming a semiconductor package with smooth edges, and a semiconductor package formed thereby is disclosed. In embodiments, after encapsulation, the semiconductor packages may be at least partially singulated from the panel by making one or more cuts through the panel to define one or more edges of the semiconductor package. The one or more edges may be smoothed by applying a laminate to the edges. The edges receiving the laminate may include any edge between a top and bottom surface of the package.

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Response to Office Action filed Sep. 21, 2009, U.S. Appl. No. 11/863,809.
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Response to Office Action filed Mar. 8, 2010, U.S. Appl. No. 11/863,809.
Notice of Allowance and Fee(s) Due dated Jun. 4, 2010, U.S. Appl. No. 11/863,809.

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