LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Encapsulated

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Injection molded integrated circuit chip assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant

Integral heat spreader for semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Integrated carrier ring/stiffener and method for manufacturing a

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant

Integrated circuit device

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Integrated circuit device

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Integrated circuit device and synchronous-link dynamic...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Integrated circuit device having a polyimide moisture barrier co

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Integrated circuit device having reduced bow and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Integrated circuit package having stress reducing recesses

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Integrated circuit package system with delamination...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant

Integrated circuit package system with heat sink

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant

Integrated circuit package system with heat sink

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant

Integrated circuit package system with heat slug

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Integrated circuit package system with molding vents

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Integrated circuit package with a heat dissipation device

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Integrated circuit package-in-package system with leads

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Integrated circuit packaging system having planar interconnect

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Integrated circuit packaging system with multi level contact...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Integrated circuit packaging system with package-on-package...