Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate
2005-08-31
2010-06-29
fahmy, Wael (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
C257S738000, C257SE23021, C257SE23069, C257SE21508, C257S678000, C257S679000, C257S680000, C257S690000, C257S730000, C257S733000, C257SE23001, C257SE23194, C257S091000, C257S177000, C257S182000
Reexamination Certificate
active
07745944
ABSTRACT:
Microelectronic devices having intermediate contacts, and associated methods of packaging microelectronic devices with intermediate contacts, are disclosed herein. A packaged microelectronic device configured in accordance with one embodiment of the invention includes a microelectronic die attached to an interconnecting substrate. The microelectronic die includes an integrated circuit electrically coupled to a plurality of terminals. Each of the terminals is electrically coupled to a corresponding first contact on the die with an individual wire-bond. Each of the first contacts on the die is electrically coupled to a corresponding second contact on the interconnecting substrate by a conductive coupler such as a solder ball.
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Armand Marc
fahmy Wael
Micro)n Technology, Inc.
Perkins Coie LLP
LandOfFree
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