Method of packaging and interconnection of integrated circuits

Details Method of packaging and interconnection of integrated circuits Method of packaging and interconnection of integrated circuits

2011-01-04

2011-01-04

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S783000, C257S723000, C257SE23116

Reexamination Certificate

active

07863762

ABSTRACT:
A method is disclosed for packaging semiconductor chips on a flexible substrate employing thin film transfer. The semiconductor chips are placed on a temporary adhesive substrate, then covered by a permanent flexible substrate with a casting layer for planarizingly embedding the chips on the permanent substrate before removing the temporary substrate. With the surface of the chips coplanar with the surface of the complete structure without any gaps, interconnect metal lines can be easily placed on the uninterrupted surface, connecting the chips and other components.

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