Molded packaging for semiconductor device and method of manufact

Details Molded packaging for semiconductor device and method of manufact Molded packaging for semiconductor device and method of manufact

1997-01-14

1999-02-09

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

257780, 257782, 257784, H01L 2348, H01L 2354, H01L 2940

Patent

active

058699058

ABSTRACT:
One end of bonding wires made of aluminium, gold, etc., is connected to a plurality of electrode pads formed on the main surface of a semiconductor chip. The other end of these bonding wires is exposed on the surface of the molded resin unit. Connecting electrodes made of aluminium are formed on top of the exposed parts of these bonding wires. The semiconductor chip and external circuitry are connected electrically by means of these connecting electrodes.

REFERENCES:
patent: 5565709 (1996-10-01), Fukushima et al.

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